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NMI Design for Manufacture Network: “Packaging in a Post Moore’s World”

UK Semiconductor Packaging IP company RFMOD will exhibit its patented high-volume solutions for the world "After-Moore".

WLPoP(TM) = Nested WLCSP solution

CLAM-LP(TM) = QFN with integrated EMI Shield and Heat-sink

Visit the stand. Visit www.RFMOD.com